DocumentCode
1902067
Title
Studying of fracture joint failure mechanism on board level reliability test process comparing between SnPb and Sn lead finished ICs
Author
Kongtongnok, Nopphadol ; Anuntapong, Suntra
Author_Institution
Adv. Micro Devices Ltd., Nonthaburi, Thailand
fYear
2003
fDate
7-11 July 2003
Firstpage
108
Lastpage
112
Abstract
In this paper, the results of the fracture joint failure mechanism and pattern when perform board level reliability test by comparing between SnPb and Pb-free lead finished ICs. It is modelling simulation by using finite element method analysis.
Keywords
finite element analysis; fracture; integrated circuit reliability; integrated circuits; lead alloys; tin; tin alloys; Sn; Sn lead finished ICs; SnPb; SnPb lead finished ICs; board level reliability test; failure mechanism; finite element method analysis; fracture; modelling; simulation; Copper; Electric variables measurement; Failure analysis; Integrated circuit testing; Lead; Performance evaluation; Silicon compounds; Soldering; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN
0-7803-7722-2
Type
conf
DOI
10.1109/IPFA.2003.1222748
Filename
1222748
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