Title :
Studying of fracture joint failure mechanism on board level reliability test process comparing between SnPb and Sn lead finished ICs
Author :
Kongtongnok, Nopphadol ; Anuntapong, Suntra
Author_Institution :
Adv. Micro Devices Ltd., Nonthaburi, Thailand
Abstract :
In this paper, the results of the fracture joint failure mechanism and pattern when perform board level reliability test by comparing between SnPb and Pb-free lead finished ICs. It is modelling simulation by using finite element method analysis.
Keywords :
finite element analysis; fracture; integrated circuit reliability; integrated circuits; lead alloys; tin; tin alloys; Sn; Sn lead finished ICs; SnPb; SnPb lead finished ICs; board level reliability test; failure mechanism; finite element method analysis; fracture; modelling; simulation; Copper; Electric variables measurement; Failure analysis; Integrated circuit testing; Lead; Performance evaluation; Silicon compounds; Soldering; Temperature; Tin;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222748
