DocumentCode
190223
Title
Direct determination of the volumetric heat capacity of liquids using a MEMS sensor and efficient evaluation methods
Author
Beigelbeck, R. ; Cerimovic, S. ; Kohl, F. ; Jachimowicz, A. ; Voglhuber-Brunnmaier, T. ; Jakoby, B.
Author_Institution
Center for Integrated Sensor Syst., Danube Univ. Krems, Wiener Neustadt, Austria
fYear
2014
fDate
2-5 Nov. 2014
Firstpage
1940
Lastpage
1943
Abstract
In Beigelbeck et al [Meas. Sci. Technol. 22 105407, 2011], we presented a MEMS sensor containing two thin-film thermistors symmetrically arranged around a resistive heater and an associated measurement procedure to consecutively determine the thermal diffusivity and conductivity of liquids. In this contribution, we report an improved sensor design combined with two novel measurement methods featuring several distinctive advantages. First, the multi-bridge design enables up to four times faster acquisition of the required temperature-frequency response. Secondly, a newly developed AC-based measurement method facilitates direct determination of the volumetric heat capacity cV of liquids which is an essential task in many condition monitoring applications. Thirdly, a novel impulse response approach allows rapid acquisition of cV. Besides the sensor device, we present an analytical model for the basic sensing principle, both measurement methods, and sample measurements performed on selected liquids.
Keywords
condition monitoring; microsensors; specific heat; temperature measurement; temperature sensors; thermal conductivity measurement; thermal diffusivity; thermistors; thin film sensors; transient response; AC-based measurement method; MEMS sensor; analytical model; condition monitoring applications; direct liquid volumetric heat capacity determination; impulse response approach; multibridge design; resistive heater; sample measurement; temperature-frequency response; thermal conductivity measurement; thermal diffusivity measurement; thin film thermistor; Conductivity; Heating; Liquids; Temperature measurement; Thermal conductivity; Thermistors; Volume measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2014 IEEE
Conference_Location
Valencia
Type
conf
DOI
10.1109/ICSENS.2014.6985411
Filename
6985411
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