DocumentCode
1902271
Title
Progressive breakdown statistics in ultra-thin silicon dioxides
Author
Loh, W.Y. ; Cho, B.J. ; Li, M.F. ; Chan, Daniel S H ; Ang, C.H. ; Zhen, Z.J. ; Kwong, D.L.
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
fYear
2003
fDate
7-11 July 2003
Firstpage
157
Lastpage
163
Abstract
We report an area-dependent gate current increase in 13.4 Å oxide. Area dependence studies show that larger sample have smaller current density increases. Using leakage current density increase as failure criterion, it was shown that smaller area samples will have shorter lifetime. By using a discrete current formalism to describe the multiple degraded spots, it was shown that leakage current can be used to deduce that distribution statistics of the oxide and that the multiple spots distribution model can be described by Weibull´s statistics.
Keywords
Weibull distribution; current density; electric breakdown; failure analysis; leakage currents; silicon compounds; thin films; SiO2; Weibull statistics; breakdown statistics; current density; discrete current; failure criterion; gate current; leakage current density; ultrathin silicon dioxides; Breakdown voltage; CMOS technology; Computer aided manufacturing; Current-voltage characteristics; Electric breakdown; Leakage current; Plasma measurements; Silicon; Statistical distributions; Statistics;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN
0-7803-7722-2
Type
conf
DOI
10.1109/IPFA.2003.1222757
Filename
1222757
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