Title :
Analysis of abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing non-connected balls
Author :
Lo, Wen-Yu ; Ker, Ming-Dou
Author_Institution :
Mixed Signal Product Div., Silicon Integrated Syst. Corp., Hsinchu, Taiwan
Abstract :
An abnormal failure mechanism due to ESD stressing on the Non-Connected (NC) balls of a high-pin-count (>500 balls) BGA packaged IC is presented. Failure analyses including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveform during ESD zapping had been performed to give clear explanation on this unusual phenomenon. New protection solutions have been proposed to solve this problem in a BGA packaged IC product with an improvement ESD robustness, which can sustain 3-kV HBM and 300-V MM ESD stresses.
Keywords :
ball grid arrays; electric current measurement; electrostatic discharge; failure analysis; integrated circuit packaging; scanning electron microscopy; 3 kV; 300 V; ESD zapping; HBM; SEM; abnormal ESD failure mechanism; current waveform; high-pin-count BGA packaged ICs; robustness; scanning electronic microscopy; stressing nonconnected balls; Current measurement; Electronics packaging; Electrostatic discharge; Failure analysis; Integrated circuit packaging; Performance evaluation; Protection; Robustness; Scanning electron microscopy; Stress;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222760
