DocumentCode
1902426
Title
A comprehensive study of corner effects in tri-gate transistors
Author
Stadele, M. ; Luyken, R.J. ; Roosz, M. ; Specht, M. ; Rosner, W. ; Dreeskornfeld, L. ; Hartwich, J. ; Hofmann, F. ; Kretz, J. ; Landgraf, E. ; Risch, L.
Author_Institution
Corporate Res. ND, Infineon Technol. AG, Munich, Germany
fYear
2004
fDate
21-23 Sept. 2004
Firstpage
165
Lastpage
168
Abstract
We have performed extensive 2D and 3D device simulations to assess the impact of gate and drain voltages, channel doping, discrete impurity effects, and the device dimensions on the electron density accumulation in the corner regions of tri-gate transistors. For channel doping concentrations higher than 1018 cm-3, these ´corner effects´ are found to dominate the device behavior. They are most pronounced in the subthreshold regime and significantly reduced in short devices with rounded corners, thin gate oxides, and narrow channels.
Keywords
MOSFET; doping profiles; electron density; semiconductor device models; channel doping; channel doping concentrations; discrete impurity effects; drain voltage; electron density accumulation; gate voltage; narrow channel devices; rounded corners; subthreshold regime; thin gate oxides; trigate transistor corner effects; Charge carrier density; Doping; Electrons; Electrostatics; Impurities; Neodymium; Numerical simulation; Poisson equations; Semiconductor process modeling; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN
0-7803-8478-4
Type
conf
DOI
10.1109/ESSDER.2004.1356515
Filename
1356515
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