DocumentCode :
1902530
Title :
STEM imaging applications in deep-sub-micron failure analysis and process characterization
Author :
Li, K. ; Er, E. ; Redkar, S.
Author_Institution :
Chartered Semicond. Manuf. Ltd., Singapore, Singapore
fYear :
2003
fDate :
7-11 July 2003
Firstpage :
206
Lastpage :
209
Abstract :
STEM imaging applications in deep-sub-micron failure analysis and process characterization have been discussed.
Keywords :
contact resistance; failure analysis; integrated circuit interconnections; interconnections; transmission electron microscopy; STEM imaging; Z-contrast technique; failure analysis; process characterization; Cameras; Copper; Detectors; Failure analysis; High-resolution imaging; Ion beams; Lenses; Light scattering; Milling; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
Type :
conf
DOI :
10.1109/IPFA.2003.1222767
Filename :
1222767
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1902530
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