• DocumentCode
    1902530
  • Title

    STEM imaging applications in deep-sub-micron failure analysis and process characterization

  • Author

    Li, K. ; Er, E. ; Redkar, S.

  • Author_Institution
    Chartered Semicond. Manuf. Ltd., Singapore, Singapore
  • fYear
    2003
  • fDate
    7-11 July 2003
  • Firstpage
    206
  • Lastpage
    209
  • Abstract
    STEM imaging applications in deep-sub-micron failure analysis and process characterization have been discussed.
  • Keywords
    contact resistance; failure analysis; integrated circuit interconnections; interconnections; transmission electron microscopy; STEM imaging; Z-contrast technique; failure analysis; process characterization; Cameras; Copper; Detectors; Failure analysis; High-resolution imaging; Ion beams; Lenses; Light scattering; Milling; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
  • Print_ISBN
    0-7803-7722-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2003.1222767
  • Filename
    1222767
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1902530