DocumentCode
1902822
Title
Wire sweep during molding of integrated circuits
Author
Nguyen, L.T. ; Lim, F.J.
Author_Institution
Signetics Co., Sunnyvale, CA, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
777
Abstract
The conditions that lead to wire sweep during transfer molding of plastic packages are examined. The parameters investigated include the material flow properties, the mold cavity/leadframe aspect ratio, the wire modulus, and the wire bond configuration (e.g. diameter, length, and orientation). Flow visualization with a clear silicone fluid and actual molding with an epoxy compound were carried out in order to quantify sweep conditions. A 14-lead bipolar device attached to a recessed copper leadframe and bonded with gold wires was the test vehicle. A functional relationship between the wire sweep behavior and the various processing parameters is presented
Keywords
gold; lead bonding; packaging; Au wires; clear silicone fluid; epoxy compound; flow visualization; functional relationship; material flow properties; mold cavity/leadframe aspect ratio; plastic packages; sweep behavior; sweep conditions; transfer molding; wire bond configuration; wire modulus; wire sweep; Bonding; Copper; Gold; Plastic integrated circuit packaging; Plastic packaging; Testing; Transfer molding; Vehicles; Visualization; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122278
Filename
122278
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