DocumentCode
1902981
Title
New methodologies of NBTI characterization eliminating recovery effects
Author
Denais, M. ; Huard, V. ; Parthasarathy, C. ; Ribes, G. ; Perrier, F. ; Revil, N. ; Bravaix, A.
Author_Institution
Central R&D DAIS, STMicroelectronics, Crolles, France
fYear
2004
fDate
21-23 Sept. 2004
Firstpage
265
Lastpage
268
Abstract
This work gives new insights of negative bias temperature instability (NBTI) characterization methodologies in advanced CMOS technology. NBTI is well-known to seriously limit the circuit performances in p-channel MOSFETs, in relation to both interface trap generation and hole trapping in the gate oxide. Hole detrapping from oxide traps during electrical parameter extractions, also called a recovery phenomenon, is unanimously acknowledged to be the most critical phenomenon avoiding a proper characterization of the effective damage. We point out here new NBTI evaluation techniques using pulsed voltages on the gate and on the drain to characterize NBT degradation and quantify recovery effects in the usual methodology.
Keywords
MOSFET; hole traps; interface states; semiconductor device measurement; semiconductor device reliability; thermal stability; CMOS technology; NBT degradation; NBTI characterization; NBTI reliability; gate oxide hole trapping; gate/drain pulsed voltage measurement technique; hole detrapping; interface trap generation; negative bias temperature instability; p-channel MOSFET; recovery effects; CMOS technology; Degradation; MOSFETs; Negative bias temperature instability; Niobium compounds; Parameter extraction; Research and development; Stress; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN
0-7803-8478-4
Type
conf
DOI
10.1109/ESSDER.2004.1356540
Filename
1356540
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