• DocumentCode
    190321
  • Title

    Low-profile, self-packaged uncooled microbolometer on a flexible substrate towards an infrared radiation sensitive skin

  • Author

    Ahmed, Moinuddin ; Butler, Donald P. ; Celik-Butler, Zeynep

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX, USA
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    2155
  • Lastpage
    2158
  • Abstract
    This paper describes fabrication and characterization of self-packaged microbolometers on a flexible substrate. Amorphous silicon (a-Si) was used as the sensing material and the entire detector was device-level packaged in a vacuum cavity with an aluminum oxide packaging layer which can withstand up to 10 atm pressure. The flicker noise coefficient K1/f was calculated to be 1.23 ×10-13 for the a-Si detecting material from the measured noise spectra.
  • Keywords
    amorphous semiconductors; bolometers; electronics packaging; flicker noise; infrared detectors; microsensors; silicon; skin; Si; device level packaging; flexible substrate; flicker noise coefficient; infrared detector; infrared radiation sensitive skin; self-packaged uncooled microbolometer; vacuum cavity; Bolometers; Choppers (circuits); Detectors; Noise; Polyimides; Resistors; Substrates; device-level-packaged; flexible substrate; uncooled infrared detector;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985465
  • Filename
    6985465
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=190321