DocumentCode :
1903514
Title :
Advanced SEU engineering using a triple well architecture [CMOS SRAM]
Author :
Puchner, H. ; Xu, Y.Z. ; Radaelli, D.
Author_Institution :
Technol. R&D, Cypress Semicond., San Jose, CA, USA
fYear :
2004
fDate :
21-23 Sept. 2004
Firstpage :
369
Lastpage :
372
Abstract :
A triple well scheme has been implemented on an 18 Mbit fast synchronous SRAM by using a high energy implant to evaluate its impact on the alpha-particle induced accelerated soft error rate (ASER). The device uses a single poly, 0.15 μm CMOS process. The SEU performance of the test vehicle shows that the advantage of the triple well isolation and better SEU performance can only be achieved by a proper design of the wells. There is a trade off in the NMOS and PMOS region for the triple well scheme. In general, it improves in the NMOS area but degrades in the PMOS area due to the increased collection volume for holes in the PMOS area. The effectiveness of the triple well architecture depends on balancing the well design and tapping scheme trade offs.
Keywords :
CMOS memory circuits; SRAM chips; alpha-particle effects; ion implantation; isolation technology; radiation hardening (electronics); 0.15 micron; 18 Mbit; CMOS process; NMOS region; PMOS area hole collection volume; SEU engineering; alpha-particle induced accelerated soft error rate; fast synchronous SRAM; high energy implant; single event upset; tapping scheme; triple well architecture; triple well isolation; Acceleration; CMOS process; Degradation; Error analysis; Implants; MOS devices; Power engineering and energy; Random access memory; Testing; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN :
0-7803-8478-4
Type :
conf
DOI :
10.1109/ESSDER.2004.1356566
Filename :
1356566
Link To Document :
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