Title :
In-line automatic defect classification [wafer fabrication]
Author :
Bennett, Marylyn Hoy ; Garvin, James F. ; Hightower, Jesse B. ; Coldren, David ; Reddy, Mahesh
Author_Institution :
Manuf. Sci. & Technol., Texas Instrum. Inc., Dallas, TX, USA
Abstract :
Manual review of wafers and classification of defects is a slow, tedious process. While identification of defects is important, this step in wafer fabrication can be a bottleneck to throughput. The accuracy of human classification can vary from day to day, and person to person. In-Line Automatic Defect Classification (ADC) is an emerging technology aimed at solving this problem
Keywords :
automatic optical inspection; electronic engineering computing; image classification; integrated circuit manufacture; production engineering computing; AOI; IC manufacture; in-line automatic defect classification; wafer fabrication; Cameras; Failure analysis; Focusing; Inspection; Instruments; Manufacturing; Optical imaging; Production; Testing; Throughput;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664582
