DocumentCode
1904085
Title
A dual Sticking Coefficient Chemical Vapor Deposition Model
Author
Wille, Holger ; Burte, Edmund P.
Author_Institution
Fraunhofer Arbeitsgruppe fÿr Integrierte Schaltungen, Artilleriestrasse 12, 8520 Erlangen, Germany
fYear
1992
fDate
14-17 Sept. 1992
Firstpage
503
Lastpage
506
Abstract
A quantitatively exact simulation of the step coverage of thin solid films prepared by low pressure chemical vapor deposition (LPCVD) is helpful to the computer aided development of the fabrication process of microelectronic devices. In addition, conclusions regarding the molecular microscopic reactions can be drawn due to our most simple physico-chemical model with only three well comprehensible parameters.
Keywords
Chemical vapor deposition; Computational modeling; Computer simulation; Differential equations; Fabrication; Microelectronics; Solid modeling; Substrates; Surface topography; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location
Leuven, Belgium
Print_ISBN
0444894780
Type
conf
Filename
5435148
Link To Document