Thermal stress/strain analysis of ceramic quad flat pack packages and interconnections

Author

Lau, John H. ; Rice, Donald W.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

824

Abstract

An elastoplastic analysis of the thermal stresses and strains in a surface-mount fine-pitch assembly using a 3-D nonlinear finite-element method is presented. This fine-pitch component is the EIAJ (Electronic Industry Associates of Japan) 160-pin ceramic quad flat pack (CQFP). For comparison purposes, the EIAJ 160-pin plastic quad flat pack (PQFP) was also analyzed. Detailed stress and strain distributions and whole-field displacements of the lead frame and solder joint are provided for a better understanding of their mechanical behavior during thermal cycling. It was found that the stresses and strains in the CQFP solder joint are larger than those in the PQFP. The results presented should be useful in the design for reliability of this class of surface-mount assemblies

Keywords

ceramics; deformation; finite element analysis; soldering; stress analysis; surface mount technology; thermal stresses; 3D nonlinear FEM; CQFP; EIAJ; SMD; SMT; ceramic quad flat pack packages; design for reliability; elastoplastic analysis; fine-pitch assembly; finite-element method; interconnections; lead frame; mechanical behavior; solder joint; surface-mount assemblies; thermal cycling; thermal stress/strain analysis; whole-field displacements; Assembly; Capacitive sensors; Ceramics; Electronic packaging thermal management; Electronics industry; Electronics packaging; Finite element methods; Plastics; Soldering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122285

Filename

122285