Title :
Short links modelling in multi-level package
Author :
Hassaïne, N. ; Mezui-Mintsa, R. ; Boudiaf, A. ; Konczykowska, A. ; Wang, H.
Author_Institution :
France Telecom, Centre National d´´Etudes des Télécommunications, Laboratoire de Bagneux, 196, Avenue Henri Ravera, 92220 Bagneux, FRANCE. Fax: (33) 1 47 46 04 17
Abstract :
A general approach for computing the inductance coefficients of short links (gold wire connections and vias) is given. The |L| matrix calculation is performed with the potential vector given in its integral form, taking into account the current density distribution (J) in the conductor. The partial element equivalent circuit method (PEEC) [1], [2] is used for this calculation. Analytical formulas easily used in CAD are derived from the numerical results using a least square fit. The simulation is compared with experimental results showing a very good agreement.
Keywords :
Bonding; Conductors; Current density; Electromagnetic analysis; Equivalent circuits; Gold; Inductance; Integrated circuit interconnections; Packaging; Wire;
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location :
Leuven, Belgium