DocumentCode :
1904405
Title :
Short links modelling in multi-level package
Author :
Hassaïne, N. ; Mezui-Mintsa, R. ; Boudiaf, A. ; Konczykowska, A. ; Wang, H.
Author_Institution :
France Telecom, Centre National d´´Etudes des Télécommunications, Laboratoire de Bagneux, 196, Avenue Henri Ravera, 92220 Bagneux, FRANCE. Fax: (33) 1 47 46 04 17
fYear :
1992
fDate :
14-17 Sept. 1992
Firstpage :
567
Lastpage :
570
Abstract :
A general approach for computing the inductance coefficients of short links (gold wire connections and vias) is given. The |L| matrix calculation is performed with the potential vector given in its integral form, taking into account the current density distribution (J) in the conductor. The partial element equivalent circuit method (PEEC) [1], [2] is used for this calculation. Analytical formulas easily used in CAD are derived from the numerical results using a least square fit. The simulation is compared with experimental results showing a very good agreement.
Keywords :
Bonding; Conductors; Current density; Electromagnetic analysis; Equivalent circuits; Gold; Inductance; Integrated circuit interconnections; Packaging; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location :
Leuven, Belgium
Print_ISBN :
0444894780
Type :
conf
Filename :
5435162
Link To Document :
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