Title :
The influence of current stress on the ageing of Au-A11% Si(1%Cu) ball-bond contacts studied by SEM and EDX
Author :
Olieslaeger, M.D. ; de Schepper, L. ; de Ceuninck, W. ; Stals, L.
Author_Institution :
Materials Physics Division, Institute for Materials Research, Limburg University Centre, 3590 Diepenbeek, Belgium
Abstract :
SEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1% Si and All %Sil %Cu.
Keywords :
Aging; Contact resistance; Electric resistance; Electrical resistance measurement; Gold; Helium; Intermetallic; Metallization; Microelectronics; Thermal stresses;
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location :
Leuven, Belgium
