• DocumentCode
    1905
  • Title

    Nondestructive Testing and Quality Control of the LHC Main Interconnection Splices

  • Author

    Heck, S. ; Solfaroli, M. ; Andreassen, O. ; Thonet, P. ; Scheuerlein, C. ; Ballarino, A. ; Bertinelli, F. ; Bottura, L. ; Fessia, P. ; Tock, J.-Ph

  • Author_Institution
    Eur. Organ. for Nucl. Res. (CERN), Geneva, Switzerland
  • Volume
    25
  • Issue
    2
  • fYear
    2015
  • fDate
    Apr-15
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The Large Hadron Collider (LHC) main interconnection splices consist of Rutherford-type cable splice and busbar stabilizer splices. Busbar stabilizer splices have been consolidated during the first long LHC shutdown by soldering additional Cu shunts. In view of the large number of quality controls (QCs) that were integrated in the splice consolidation process, efficient and unambiguous QC procedures needed to be developed. Direct-current electrical resistance measurements have been selected for the control of the busbar splices and the individual shunts. About 400 000 resistance measurements performed at room temperature before and after each consolidation step have been analyzed. The resistance of the consolidated splices is comparable with the resistance of continuous busbars without splice. Resistance changes during the consolidation process correspond to those calculated from the changes in Cu cross-sectional area.
  • Keywords
    busbars; copper; electric resistance; electric resistance measurement; nondestructive testing; quality control; soldering; splicing; superconducting cables; superconducting interconnections; superconducting magnets; Cu; Cu cross-sectional area; Cu shunts; Rutherford-type cable splice; busbar stabilizer splices; direct-current electrical resistance measurements; efficient quality control procedure; large hadron collider main interconnection splices; nondestructive testing; resistance changes; soldering; splice consolidation process; Electrical resistance measurement; Large Hadron Collider; Machining; Quality control; Resistance; Temperature measurement; Busbars; Interconnections; Non-destructive Testing; Resistance measurement; Superconducting cables; interconnections; nondestructive testing (NDT); resistance measurement; superconducting cables;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2014.2363056
  • Filename
    6928412