DocumentCode :
1905006
Title :
Automated parameter extraction software for silicon and high-voltage silicon carbide power diodes
Author :
Yang, Nanying ; Duong, Tam ; Jeong, Jeong-O ; Ortiz, Jose M. ; Hefner, Allen ; Meehan, Kathleen
fYear :
2010
fDate :
28-30 June 2010
Firstpage :
1
Lastpage :
8
Abstract :
This paper presents an automated parameter extraction software package developed for constructing silicon (Si) and silicon carbide (SiC) power diode models, which is called DIode Model Parameter extrACtion Tools (DIMPACT). This software tool extracts the data necessary to establish a library of power diode component models and provides a method for quantitatively comparing between different types of devices and establishing performance metrics for device development. To verify the accuracy of DIMPACT, the extracted model parameter sets are incorporated into the circuit simulation software to compare model predictions with measured static and transient diode characteristics. In this paper, the DIMPACT parameter extraction results are demonstrated for a 45 V, 15 A Si Schottky diode; a 600 V, 200 A Si PiN diode; a 10 kV, 5 A SiC Junction Barrier Schottky (JBS) diode; and a 10 kV, 20 A SiC PiN diode. The validation results indicate that the model parameters extracted using DIMPACT are accurate.
Keywords :
Schottky diodes; circuit simulation; electronic engineering computing; p-i-n diodes; silicon compounds; DIMPACT; SiC; SiC PiN diode; SiC junction barrier Schottky diode; automated parameter extraction software; circuit simulation software; current 15 A; current 20 A; current 200 A; current 5 A; diode model parameter extraction tools; power diode component models; silicon carbide power diode; silicon power diode; voltage 10 kV; voltage 45 V; voltage 600 V; Current measurement; Equations; Integrated circuit modeling; Mathematical model; Parameter extraction; Schottky diodes; Power diodes; SiC; parameter extraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Control and Modeling for Power Electronics (COMPEL), 2010 IEEE 12th Workshop on
Conference_Location :
Boulder, CO
Print_ISBN :
978-1-4244-7462-2
Electronic_ISBN :
978-1-4244-7461-5
Type :
conf
DOI :
10.1109/COMPEL.2010.5562392
Filename :
5562392
Link To Document :
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