Interconnect for Out-of-Plane Mems Assembly

An out-of-plane interconnect system has been demonstrated. With this type of interconnect approach, different silicon micromachined dies can be electrically and mechanically connected perpendicular to a backbone. The structures are inserted into cavities (which act as sockets) and the electrical contact is established by means of overhanging gold clips. Passive test structures containing daisy chains have been made and assembled perpendicular to the substrate using a flip-chip bonder.