DocumentCode
1905350
Title
Current Density Analysis of Thin Film Effect in Contact Area on LED Wafer
Author
Sawada, Shigeru ; Tsukiji, Shigeki ; Shimada, Shigeki ; Tamai, Terutaka ; Hattori, Yasuhiro
fYear
2012
fDate
23-26 Sept. 2012
Firstpage
1
Lastpage
6
Abstract
In order to clarify the theory of contact resistance, there are many reports in these years. Mathematically the constriction current is derived from Laplace equation at one contact. And numerical approach for constriction current analysis was also preformed by Minowa and Sawada. Furthermore, as an experimental approach, Sawada et al. are successful in in-situ observation of current constriction inside the contact utilizing the behavior of the wafer for light emitting diodes that light is emitted in the position where the current flows. In this study, we attempted to give consideration to how the constriction resistance changes for the thin film wafer by comparing an experimental method, an analytical method, and theoretical values. As results, it was proved that when the film is as thick as 200μm, both experimental results and analytical results roughly matched with the theoretical values of the constriction resistance. However, when the film gets thinner to 50μm, the constriction resistance was larger than the theoretical values (R=ρ/2a). In addition, the values of contact resistance almost matched with the experimental values. These results determine that contact resistance in the thin film can be calculated using electric field analysis.
Keywords
Laplace equations; contact resistance; current density; electric field effects; electrical contacts; light emitting diodes; semiconductor thin films; LED wafer; Laplace equation; constriction current analysis; constriction resistance; contact area; contact resistance; current constriction; current density analysis; electric field analysis; in-situ observation; light emission; light emitting diodes; thin film effect; thin film wafer; Analytical models; Contacts; Films; Resistance; Rough surfaces; Semiconductor device modeling; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts (Holm), 2012 IEEE 58th Holm Conference on
Conference_Location
Portland, OR
ISSN
1062-6808
Print_ISBN
978-1-4673-0778-9
Type
conf
DOI
10.1109/HOLM.2012.6336576
Filename
6336576
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