Title :
Computer-controlled thermal cycling tool to aid in SiC module package characterization
Author :
Hernández-Mora, M. ; Ortiz-Rodríguez, J.M. ; Grummel, B. ; Hefner, A.R., Jr. ; Berning, D. ; Hood, C. ; McCluskey, P.
Author_Institution :
Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Abstract :
A software-controlled thermal cycling test system developed for SiC module package characterization is presented. The software interface permits the flexible definition of testing parameters such as variable data acquisition rates, customizable cycle transition´s duration, and the independently controlled heating and cooling rates of the test. The cycle´s heating is provided by a controlled power supply, while two independent mass flow controllers provide the cycle´s cooling control, which can be a combination of air and water flows depending on the test conditions. The interface provides visual feedback by continuously showing the heatplate temperature and the thermal cycling measurements in situ. The system has shown to be a useful tool in a comprehensive package degradation project through the monitoring package and electrical variation due to thermal cycling.
Keywords :
heating elements; modules; power electronics; power engineering computing; user interfaces; SiC; SiC module package characterization; air flow; computer controlled thermal cycling tool; controlled heating; controlled power supply; customizable cycle transition duration; cycle cooling control; heatplate temperature; mass flow controller; software interface; thermal cycling measurement; variable data acquisition rate; visual feedback; water flow; Cooling; Electronic packaging thermal management; Power supplies; Temperature measurement; Water heating;
Conference_Titel :
Control and Modeling for Power Electronics (COMPEL), 2010 IEEE 12th Workshop on
Conference_Location :
Boulder, CO
Print_ISBN :
978-1-4244-7462-2
Electronic_ISBN :
978-1-4244-7461-5
DOI :
10.1109/COMPEL.2010.5562415