Concerning layout synthesis for power electronic multi-chip modules

Multi-chip power module design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure that is time-consuming and requires multiple design runs. The existing Power-CAD methodology that automates the module design process and optimizes the layout has been extended in this work to incorporate multi-chip power modules (MCPMs) and perform a complete layout synthesis of MCPMs. Power-CAD performs advanced model abstraction for the thermal characteristics from a finite element analysis, electrical parasitic extraction, electrothermal simulation, optimization using geometry-dependent thermal and parasitic models and optimal layout generation. This work promises to achieve tremendous cost savings for the MCPM design industry and be the first MCPM layout synthesis tool.