DocumentCode
1905847
Title
New Corrosion Resistant Plating to Reduce Gold Consumption in Connectors
Author
Chou, George J S
fYear
2012
fDate
23-26 Sept. 2012
Firstpage
1
Lastpage
5
Abstract
A new plating structure consisting of a seal layer on top of copper substrate and beneath a conventional gold/nickel finish shows excellent corrosion resistance even when using a thin gold finish for contact applications. Compared to the severe copper creep corrosion on conventional gold/nickel finishes, the new corrosion resistant plating prevents the copper creep corrosion and maintains low and stable contact resistance after 5-day mixed flowing gas (MFG) Class IIIA exposure.
Keywords
copper; corrosion resistance; creep; electric connectors; electrical contacts; electroplating; gold; nickel; MFG class IIIA exposure; connectors; contact application; contact resistance; copper creep corrosion; copper substrate; corrosion resistant plating; gold consumption reduction; gold-nickel finish; mixed flowing gas; seal layer; Copper; Corrosion; Gold; Nickel; Resistance; Seals; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts (Holm), 2012 IEEE 58th Holm Conference on
Conference_Location
Portland, OR
ISSN
1062-6808
Print_ISBN
978-1-4673-0778-9
Type
conf
DOI
10.1109/HOLM.2012.6336595
Filename
6336595
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