Title :
Numerical analysis of field coupling to microstrip circuits
Author :
Badawi, A. ; Sebak, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
Abstract :
Analysis of field coupling and emissions from printed circuit boards (PCBs) is important for assessment of the immunity of the PCB to external radiation. Immunity of electronic systems is now tightly regulated in consumer markets. This paper presents a procedure for the analysis of susceptibility of PCBs. The procedure identifies a finite set of source and field points to increase the efficiency of the numerical testing. Reciprocity is used to decrease the number of external source locations that need to be used in the field coupling analysis through performing a radiation analysis. The numerical analysis of the PCB is performed using the Method of Moments (MoM). Numerical examples for the application of method are included. Further examples of the overall procedure will be presented
Keywords :
electromagnetic interference; method of moments; microstrip circuits; printed circuit design; external radiation; field coupling; method of moments; microstrip circuits; numerical testing; printed circuit boards; radiation analysis; reciprocity; susceptibility; Circuit testing; Coupling circuits; Frequency; Impedance; Message-oriented middleware; Microstrip; Moment methods; Numerical analysis; Printed circuits; Transmission line matrix methods;
Conference_Titel :
Electrical and Computer Engineering, 2002. IEEE CCECE 2002. Canadian Conference on
Conference_Location :
Winnipeg, Man.
Print_ISBN :
0-7803-7514-9
DOI :
10.1109/CCECE.2002.1015239
