DocumentCode
1906435
Title
HDI detection by using an AE technique
Author
Sodsri, Chuchat ; Choomchuay, Somsak
Author_Institution
Dept. of Data Storage Technol. Int., King Mongkut´s Inst. of Technol. Ladkrabang, Bangkok, Thailand
fYear
2013
fDate
4-6 Sept. 2013
Firstpage
585
Lastpage
588
Abstract
Acoustic Emission(AE) sensors are commonly used in non-destructive testing to monitor generation and propagation of contact, bending, torsion and crack in material; including magnetic head-disk interaction (HDI). In Hard Disk Drive (HDD) manufacturing process, HDI is the one of mechanical failure which need to scrap all components due to cleanliness concerns. However, the segregating process between true and false HDI failures are mainly difficult to detect due to inadequate information. differentiate actual from false HDI. This paper presents the detection of the HDI using AE sensor - stress wave technique with Bending and Torsional modes during spin up and loading head state. The AE sensor is placed outside the HDD to measure AE voltage signal since the drive start up. The AE voltage will be converted to be AE rms. The AE rms threshold, which is used the delta of AE rms between spin up and loading head to disk, can be used as a criterion to differentiate actual from false HDI.
Keywords
acoustic devices; acoustic emission testing; bending; crack detection; disc drives; failure (mechanical); hard discs; magnetic sensors; mechanical contact; sensor placement; torsion; voltage measurement; AE rms threshold; AE sensor placement technique; AE sensor stress wave technique; AE voltage conversion; AE voltage signal measurement; acoustic emission; bending mode; cleanliness concern; crack detection; hard disk drive; head disk interaction; loading head state; magnetic HDI detection; magnetic device; material contact; mechanical failure; nondestructive testing; segregating process; spin up state; torsional mode; Assembly; Frequency-domain analysis; Loading; Magnetic heads; Media; Sensors; Stress; Acoustic Emission; Hard disk drive; Head Disk Assembly; Head-Disk Interaction; Print Circuit Board Assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications and Information Technologies (ISCIT), 2013 13th International Symposium on
Conference_Location
Surat Thani
Print_ISBN
978-1-4673-5578-0
Type
conf
DOI
10.1109/ISCIT.2013.6645926
Filename
6645926
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