DocumentCode :
1906486
Title :
Probe position control for enhanced resolution of electrostatic force microscopy
Author :
Weng, Z. ; Bridges, G.E. ; Thomson, D.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
Volume :
1
fYear :
2002
fDate :
2002
Firstpage :
378
Abstract :
Electrostatic force microscopy (EFM) testing is an extremely useful tool for non-contact internal function and failure analysis of high-speed integrated circuits. Internal circuit voltages are measured by sensing the local electrostatic force on a small micromachined probe that is held in close proximity to the circuit measurement point. Since electrical forces are longrange in nature, the tip-to-sample spacing is usually the determining factor for the EFM instrument spatial resolution and is typically the same order as the spacing. To significantly improve the EFM instrument spatial resolution and voltage sensitivity, a position feedback system, based on controlling the capacitance gradient, is presented to maintain the tip-to-sample spacing to approximately 100 nm. For such small separations, the feedback system prevents the tip from crashing into the surface due to either environmental disturbances or snapping into the surface due to the electrical force gradient.
Keywords :
capacitance; circuit feedback; control system synthesis; electric field measurement; failure analysis; integrated circuit measurement; integrated circuit reliability; micropositioning; perturbation techniques; probes; scanning probe microscopy; voltage measurement; 100 nm; EFM enhanced resolution; EFM instrument spatial resolution; EFM voltage sensitivity; capacitance gradient control; circuit measurement point probe proximity; electrostatic force microscopy testing; high-speed IC failure analysis; internal circuit voltage measurement; local electrostatic force sensing; long range electrical forces; micromachined probes; noncontact internal function analysis; perturbation control; position feedback system; probe position control; tip environmental disturbances; tip surface crash; tip surface electrical force gradient snap; tip-to-sample separation; tip-to-sample spacing; Circuit testing; Electrostatic measurements; Force feedback; Force measurement; Instruments; Integrated circuit measurements; Microscopy; Position control; Probes; Spatial resolution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Computer Engineering, 2002. IEEE CCECE 2002. Canadian Conference on
ISSN :
0840-7789
Print_ISBN :
0-7803-7514-9
Type :
conf
DOI :
10.1109/CCECE.2002.1015253
Filename :
1015253
Link To Document :
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