An aramid/epoxy substrates increased the facility of rigid-flexible substrates for high performance use

Author

Tsunashima, Eiichi ; Okuno, Atsushi ; Oyama, Noritaka ; Hirakawa, Tadashi ; Nishimura, Kunio

Author_Institution

Matsushita Electron. Corp., Kyoto, Japan

fYear

1990

fDate

20-23 May 1990

Firstpage

901

Abstract

A material has been developed for fabricating rigid-flexible printed boards. The material includes copper-clad laminates (TL-01) and prepregs (ET-100) consisting of a recently developed aramid paper made of an aramid fiber from poly-paraphenylene 3,4´ diphenilether terephthalamid (PPDETA) as a reinforcement, and a sophisticated epoxy resin system having high affinity to an aramid fiber as an impregnant. The dimensional stability of the multilayer system has been shown to surpass that of the conventional lamination system of FR-4, polyimide films, and acrylic adhesives. A flexural fatigue test on the flexible printed wiring has been carried out, and the flexible material revealed a higher flexibility than FR-4. Copper migration has been observed after full absorption of moisture by a pressure cooker test (PCT). TL-01 has shown an excellent resistance to migration for more than 50 h, while polyimide film with an acrylic adhesive has shown a heavy migration. It is concluded that this material may be useful for advanced rigid-flex multilayer printed boards suitable for surface mount technologies

Keywords

polymers; printed circuits; substrates; surface mount technology; Cu clad laminates; Cu migration; ET-100; PPDETA; TL-01; aramid fiber; aramid paper; aramid/epoxy substrates; dimensional stability; epoxy resin system; flexible printed wiring; flexural fatigue test; high performance use; impregnant; lamination system; multilayer PCB; multilayer system; poly-paraphenylene 3,4´ diphenilether terephthalamid; prepregs; pressure cooker test; printed boards; rigid-flexible substrates; surface mount technologies; Epoxy resins; Fatigue; Laminates; Lamination; Materials testing; Nonhomogeneous media; Optical fiber testing; Polyimides; Stability; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122296

Filename

122296