DocumentCode :
1907023
Title :
Novel Honeycomb SOI Structure with Low Parasitic Capacitance for Human-Sensing Accelerometer
Author :
Yokomatsu, T. ; Takeuchi, H. ; Miyagawa, Y. ; Kanda, K. ; Fujita, Takashi ; Higuchi, Kenichi ; Maenaka, Kazusuke
fYear :
2012
fDate :
5-7 Nov. 2012
Firstpage :
70
Lastpage :
74
Abstract :
To realize extremely low-power consuming sensor systems, a SOHI (Silicon on Honeycomb Insulator) wafer, which has ultra-small parasitic capacitance, is proposed and an accelerometer is fabricated to demonstrate use of the technique. In case of using a low-power-consumption switched capacitor measurement circuit, parasitic capacitance decreases sensor sensitivity dramatically. The concept of the SOHI wafer is a special SOI (Silicon on Insulator) wafer with the buried SiO2 layer replaced with a honeycomb-shaped SiO2 thick layer (20 Ým thick) to reduce the parasitic capacitance. In this paper, two types of SOHI wafer, which could reduce the parasitic capacitance to about 21% and 2% of typical SOI wafers, respectively are proposed. On a trial production, the structure of a prototype three-dimensional accelerometer is fabricated. By demonstrating the application of sensor fabrication, the SOHI wafer is shown as a useable material as the base substrate. Also, the ability to realize the accelerometer with low parasitic capacitance by using the SOHI wafer is demonstrated.
Keywords :
accelerometers; capacitance; capacitor switching; elemental semiconductors; honeycomb structures; silicon; silicon compounds; silicon-on-insulator; thin film sensors; 3D human sensing accelerometer; SOHI wafer; Si; SiO2; honeycomb SOI structure; parasitic capacitance; sensor fabrication; silicon on honeycomb insulator; size 20 mum; switched capacitor measurement circuit; Accelerometer; Honeycomb structure; Low parasitic capacitance; Silicon on Insulator;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Trends in Engineering and Technology (ICETET), 2012 Fifth International Conference on
Conference_Location :
Himeji
ISSN :
2157-0477
Print_ISBN :
978-1-4799-0276-7
Type :
conf
DOI :
10.1109/ICETET.2012.21
Filename :
6495190
Link To Document :
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