Title :
Wafer Level Packaging for MEMS Geiger Counter
Author :
Miyamoto, Ayaho ; Hashimoto, Toshikazu ; Makimura, K. ; Kanda, K. ; Fujita, Takashi ; Maenaka, Kazusuke
Author_Institution :
Grad. Sch. of Eng., Univ. of Hyogo, Himeji, Japan
Abstract :
The size of conventional Geiger counters is large because the detector (GM tubes: Geiger muller tubes) is fabricated by mechanical processing. In this paper, an MEMS (micro electro mechanical systems) GM tube using a wafer level packaging is proposed. The MEMS-GM tube with glass/Si/glass stacked structure was fabricated by using anodic bonding and polymer bonding. With the supplied voltage of 2.6 kV to the MEMS-GM tube, pulse waves were observed when an radioactive material approached to the fabricated device.
Keywords :
Geiger counters; elemental semiconductors; glass; microfabrication; microsensors; polymers; silicon; silicon compounds; wafer bonding; wafer level packaging; MEMS GM tube; MEMS Geiger counter; SiO2-Si-SiO2; anodic bonding; mechanical processing; microelectromechanical system; microfabrication; polymer bonding; pulse wave; radioactive material; voltage 2.6 kV; wafer level packaging; Geiger counter; MEMS; wafer level packaging;
Conference_Titel :
Emerging Trends in Engineering and Technology (ICETET), 2012 Fifth International Conference on
Conference_Location :
Himeji
Print_ISBN :
978-1-4799-0276-7
DOI :
10.1109/ICETET.2012.20
