Title :
A microseismic piezofilm sensor
Author :
Daku, Brian L F ; Prugger, Arnfinn F.
Author_Institution :
Dept. of Electr. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada
Abstract :
Monitoring seismic activity in mines is an important issue for mine safety. This seismic activity is produced by high stress faults in the vicinity of the mining operations. To estimate the location of a radiating seismic source the acoustic pressure wave travelling through the rock must be recorded at a number of sensors throughout the mine. The arrival time estimates for a seismic event are then used to locate the source. This low-energy seismic activity in mines is typically referred to as microseismic events. This paper focuses on a alternative sensor for recording microseismic activity. This sensor uses piezofilm as the sensing element. Piezofilm is a piezoelectric polymer that generates a charge when it is mechanically deformed. It is a flexible, lightweight, tough plastic film, which is extremely sensitive to any mechanical deformation. The paper describes the sensor, which can be modelled as a second order system. Laboratory results characterizing the sensor are presented. Finally, some in-mine tests comparing the piezofilm sensor with a commercial geophone sensor are presented.
Keywords :
mining; piezoelectric thin films; piezoelectric transducers; polymer films; safety; seismology; seismometers; vibration measurement; arrival time estimates; charge generating piezoelectric polymer; geophone sensor in-mine tests; high stress faults; lightweight flexible film; low-energy seismic activity; mechanical sensor deformation sensitivity; microseismic events; microseismic piezofilm sensor; mine safety; mine seismic activity monitoring; mining applications; mining operation vicinity; piezofilm sensing element; pressure wave sensor recording; radiating seismic source location; rock acoustic pressure wave; second order systems; sensor characterization; tough plastic film; Acoustic sensors; Acoustic waves; Mechanical sensors; Monitoring; Plastic films; Polymers; Radiation safety; Sensor phenomena and characterization; Sensor systems; Stress;
Conference_Titel :
Electrical and Computer Engineering, 2002. IEEE CCECE 2002. Canadian Conference on
Print_ISBN :
0-7803-7514-9
DOI :
10.1109/CCECE.2002.1015274