Experimental Performance Analysis Of New Ag Conductive Glues For Electronic Applications

As a result of a deepened risk analysis on electronic systems [1], it is emerged the necessity to modify the soldering process of all the devices under the RoHS European Directive [2]. Therefore the research is oriented to the study of application of new materials for the realization of connections in electronic devices and the analysis of their reliability performances. In this paper it is shown the preliminary results of a new study of the use of conductive materials without lead [2] for the adhesion of the plate, which has piezoelectric properties, with the fingers´ comb. The methodology for its application, that is characterized by the critical steps of spreading and centrifugation, is also taken into account. Found a possible variability of the samples from the production process, it has been thought opportune to apply D.O.E. (design of experiments) [3], as a valid statistical support for understanding the degrees of correlation between the interested +variables. After having chosen the output control characteristics of the process, (measures of electrical resistance and capacity of every single element of transducer´s array) the variables, which are potentially responsible of the uncertainty on the aforesaid measures, have been characterized. The samples are implemented and the results are discussed in this paper.