• DocumentCode
    1908250
  • Title

    Atomistic modeling of the thermoelectric power factor in ultra-scaled Silicon nanowires

  • Author

    Paul, Abhijeet ; Klimeck, Gerhard

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2010
  • fDate
    13-14 June 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Dimensional scaling provides an alternative route to improve the thermoelectric figure of merit (ZT) by the reduction of the lattice thermal conductivity(κl). However, this method is reaching the scaling limit. Further improvement in ZT can be achieved by improving the thermoelectric power-factor (S2G), the numerator of ZT. In this work we study this part of ZT using a combination of semi-empirical Tight-Binding method and Landauer approach. We study the effect of cross-sectional confinement, wire orientation and uniaxial strain on the power-factor (PF). It is found that any improvement in PF is only achieved for wires with cross-section size less than 6nm × 6nm.
  • Keywords
    nanowires; power factor; silicon; thermal conductivity; thermoelectric power; tight-binding calculations; Landauer approach; Si; atomistic modeling; combination; cross-section size; cross-sectional confinement effect; dimensional scaling; lattice thermal conductivity reduction; scaling limit; semiempirical tight-binding method; thermoelectric figure of merit; thermoelectric power factor; ultrascaled silicon nanowires; uniaxial strain; wire orientation; Conductivity; Nanowires; Silicon; Thermal conductivity; Uniaxial strain; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Nanoelectronics Workshop (SNW), 2010
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-7727-2
  • Electronic_ISBN
    978-1-4244-7726-5
  • Type

    conf

  • DOI
    10.1109/SNW.2010.5562583
  • Filename
    5562583