DocumentCode
1908645
Title
Use of sensor embedded products for end of life processing
Author
Ilgin, Mehmet Ali ; Gupta, Surendra M.
Author_Institution
Northeastern Univ., Boston, MA, USA
fYear
2010
fDate
5-8 Dec. 2010
Firstpage
1584
Lastpage
1591
Abstract
Sensors embedded into products during the production process have a potential to decrease disassembly yield uncertainty by detecting non-functional or missing components prior to the actual disassembly process. The aim of this study is the quantitative evaluation of the impact of sensor embedded products (SEPs) on the performance of an appliance disassembly line. First, separate design of experiments studies based on orthogonal arrays are performed for the cases with and without SEPs. Discrete event simulation models of both cases were developed to calculate various performance measures under different experimental conditions. Then, the results of pair-wise t-tests comparing the two cases, based on different performance measures, are presented. The results show the superiority of SEPs over conventional products for all performance measures considered in the study.
Keywords
assembling; design for disassembly; discrete event simulation; domestic appliances; embedded systems; production engineering computing; recycling; appliance disassembly line; disassembly yield uncertainty; discrete event simulation model; life processing; missing components; nonfunctional components; pair-wise t-tests; production process; quantitative evaluation; sensor embedded products; Computers; Heating; Mathematical model; Ovens; Printed circuits; Steel; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference (WSC), Proceedings of the 2010 Winter
Conference_Location
Baltimore, MD
ISSN
0891-7736
Print_ISBN
978-1-4244-9866-6
Type
conf
DOI
10.1109/WSC.2010.5678912
Filename
5678912
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