DocumentCode
1909047
Title
The 3-D IC with 4-layer Structure for the Fast Range Sensing System
Author
Akasaka, Y. ; Inoue, Y. ; Nakaya, M. ; Nishimura, T.
Author_Institution
LSI Laboratory, Mitsubishi Electric Corp., 4-1 Mizuhara Itami 664 Japan
fYear
1991
fDate
16-19 Sept. 1991
Firstpage
183
Lastpage
186
Abstract
The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system.
Keywords
Application specific integrated circuits; CMOS image sensors; CMOS integrated circuits; CMOS logic circuits; Image converters; MOS devices; Sensor arrays; Signal design; Signal processing; Three-dimensional integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location
Montreux, Switzerland
Print_ISBN
0444890661
Type
conf
Filename
5435345
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