Title :
4-Layer 3-D IC with a function of parallel signal processing
Author :
Itoh, Y. ; Wada, A. ; Morimoto, K. ; Tomita, Y. ; Yamazaki, K.
Author_Institution :
3-15, Yagumo-nakamachi, Moriguchi, Osaka 570, Japan, Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd.
Abstract :
A 4-layer 3-D IC was designed and fabricated as a primitive 3-D device with a function of parallel signal processing. The 3-D IC has the following 4 layers: optical sensor, level-detector, memory and ALU. The chip features array information input using optical sensor, vertical transfer of array information using via-holes and parallel processing. The fundamental operation of moving object sensing was confirmed.
Keywords :
Array signal processing; Optical arrays; Optical design; Optical sensors; Optical signal processing; Sensor arrays; Signal design; Signal processing; Silicon on insulator technology; Three-dimensional integrated circuits;
Conference_Titel :
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location :
Montreux, Switzerland
