• DocumentCode
    1909524
  • Title

    A pull/push concept for toolgroup workload balance in wafer fab

  • Author

    Zhou, Zhugen ; Rose, Oliver

  • Author_Institution
    Inst. of Appl. Comput. Sci., Dresden Univ. of Technol., Dresden, Germany
  • fYear
    2010
  • fDate
    5-8 Dec. 2010
  • Firstpage
    2516
  • Lastpage
    2522
  • Abstract
    In this paper, a pull/push concept is proposed in order to balance toolgroup workload in a wafer fab. This is accomplished by using a so-called WIP Control Table. Each upstream toolgroup maintains a WIP Control Table which contains current WIP information of downstream toolgroups such as target WIP, actual WIP and WIP difference. In case of lot move in/out and tool status change, the WIP Control Table is updated. Therefore, the upstream toolgroup is able to detect WIP distribution and pull request of downstream toolgroups dynamically, then push optimal lots with consideration of lot status and local tool constraint to the downstream toolgroup which runs short of WIP. The simulation results demonstrate that the proposed pull/push concept is superior over First-in-First-out (FIFO) and Operation Due Date (ODD) with regard to average cycle time and on time delivery.
  • Keywords
    batch processing (industrial); production engineering computing; push-pull production; wafer level packaging; WIP control table; WIP difference; WIP information; actual WIP; downstream toolgroup; pull-push concept; target WIP; toolgroup workload; wafer fab; Acceleration; Data models; Dispatching; Load modeling; Loading; Semiconductor device modeling; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2010 Winter
  • Conference_Location
    Baltimore, MD
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4244-9866-6
  • Type

    conf

  • DOI
    10.1109/WSC.2010.5678947
  • Filename
    5678947