DocumentCode :
1909636
Title :
Towards realization of a high-fidelity simulation model for short-term horizon forecasting in wafer fabrication facilities
Author :
Scholl, Wolfgang ; Gan, Boon Ping ; Peh, Ming Li ; Lendermann, Peter ; Noack, Daniel ; Rose, Oliver ; Preuss, Patrick
Author_Institution :
Infineon Technol. Dresden, Dresden, Germany
fYear :
2010
fDate :
5-8 Dec. 2010
Firstpage :
2563
Lastpage :
2574
Abstract :
Discrete Event Simulation (DES) has widely been used for mid and long term forecasting in wafer fabrication plants. But the use of DES for short term forecasting has been limited due to the perceived modelling and computation complexity as well as the non-steady state nature of today´s wafer fab operations. In this paper, we discuss some important modelling issues associated with building an online simulation model. Key elements considered are actual process routes, process and throughput modelling as a function of equipment behavior, lot size, and available processing modules, process dedication at equipment level, equipment downs at mainframe level, estimated lot release strategy, send ahead wafers, dispatch rules, and setup. Typical application areas are proactive dedication management, preventive maintenance scheduling and WIP based sampling optimization.
Keywords :
computational complexity; discrete event simulation; forecasting theory; production engineering computing; semiconductor industry; wafer level packaging; WIP; actual process routes; computation complexity; discrete event simulation; high-fidelity simulation model; nonsteady state; online simulation model; preventive maintenance scheduling; proactive dedication management; process modelling; sampling optimization; short term horizon forecasting; throughput modelling; wafer fabrication plant; Analytical models; Computational modeling; Data models; Predictive models; Production; Semiconductor device modeling; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference (WSC), Proceedings of the 2010 Winter
Conference_Location :
Baltimore, MD
ISSN :
0891-7736
Print_ISBN :
978-1-4244-9866-6
Type :
conf
DOI :
10.1109/WSC.2010.5678952
Filename :
5678952
Link To Document :
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