A high performance electrical and optical interconnection technology

Author

Ryckebusch, M.

Author_Institution

Alcatel Bell, Antwerp, Belgium

fYear

1990

fDate

20-23 May 1990

Firstpage

974

Abstract

A printed circuit board technology has been developed for high-speed, high-density electronic circuits built from components with high power dissipation. The technology consists of a metal core with discrete conductors at both sides. Low thermal resistance has been realized by placing the component packages against the metal core. The edges of the metal can be contacted to heat sinks or conducting board guides. The board technology has been characterized for both electrical and thermal performance (natural and forced convection) and validated as an alternative technology for a high-performance system. Electrical design rules for high-speed interconnections have been established. It is projected that, in the future, the interconnection density will be increased and more unconventional cooling mechanisms such as conduction or liquid cooling will be used

Keywords

heat transfer; optical fibres; optical interconnections; packaging; printed circuits; thermal analysis; PCB technology; component packages; conducting board guides; cooling; discrete conductors; forced convection; heat sinks; high-density electronic circuits; high-speed circuits; high-speed interconnections; metal core; optical interconnection technology; printed circuit board; thermal performance; Conductors; Contacts; Electric resistance; Electronic circuits; Electronic packaging thermal management; Integrated circuit interconnections; Optical interconnections; Power dissipation; Printed circuits; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122306

Filename

122306