• DocumentCode
    1909880
  • Title

    Versatile Sensor Front End for Low-Depth Modulation Capacitive Sensors

  • Author

    Bretterklieber, T. ; Zangl, Hubert ; Motz, Markus ; Werth, T.

  • Author_Institution
    Christian Doppler Lab. for Automotive Meas. Res., Graz Univ. of Technol., Graz
  • fYear
    2008
  • fDate
    12-15 May 2008
  • Firstpage
    830
  • Lastpage
    835
  • Abstract
    Low-depth modulation capacitive sensors, i.e. sensors where the capacitance variations caused by a measurand are only a small fraction of the total capacitance, are frequently encountered in measurement problems. Furthermore, also a conductance (e.g. due to parasitic conductive staining) between the sensor electrodes may affect the capacitance evaluation. We have implemented a capacitive sensor interface in a 0.25 mum CMOS process capable of measuring both conductive and capacitive coupling. The sensor interface provides an offset capacitance compensation and an offset conductance compensation such that a low-depth capacitance modulation can be mapped onto the full scale range of an analog to digital converter. Experimental results for a prototype sensor interface with a capacitive slider array are presented.
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; capacitive sensors; CMOS process; analog-to-digital converter; capacitive coupling; capacitive slider array; conductive coupling; low-depth modulation capacitive sensors; offset capacitance compensation; parasitic conductive staining; sensor interface; versatile sensor front end; Analog-digital conversion; CMOS process; Capacitance measurement; Capacitive sensors; Conductivity measurement; Digital modulation; Electrodes; Parasitic capacitance; Prototypes; Sensor arrays; Capacitance to digital converter; Capacitive slider array; Low-Depth modulation capacitive sensors; Offset compensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference Proceedings, 2008. IMTC 2008. IEEE
  • Conference_Location
    Victoria, BC
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4244-1540-3
  • Electronic_ISBN
    1091-5281
  • Type

    conf

  • DOI
    10.1109/IMTC.2008.4547152
  • Filename
    4547152