DocumentCode
1909950
Title
Electrical properties of thin SiO2 films nitrided in N2 O by rapid thermal processing
Author
Severi, M. ; Mattei, G. ; Dori, L. ; Maccagnani, P. ; Baldini, G.L. ; Pizzochero, G.
Author_Institution
CNR-Istituto LAMEL, Via Castagnoli 1, I-40126 Bologna, Italy
fYear
1992
fDate
14-17 Sept. 1992
Firstpage
657
Lastpage
660
Abstract
Charge trapping and dielectric wear-out properties of 8 and 30 nm SiO2 layers nitrided in the N2 O gas using a Rapid Thermal System are evaluated injecting charge at either low (by avalanche technique) or high (by Fowler-Nordheim technique) electric fields. In the experimental conditions studied, the results have pointed out that, compared to a standard silicon dioxide layer, a SiO2 film nitrided in the N2 O gas exhibits a reduced electron/hole trapping efficiency and, independently of the injection polarity, an improved charge-to-breakdown (QBD ) characteristics.
Keywords
Annealing; Charge carrier processes; Design for quality; Dielectric thin films; Electron traps; Oxidation; Rapid thermal processing; Semiconductor films; Silicon compounds; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location
Leuven, Belgium
Print_ISBN
0444894780
Type
conf
Filename
5435379
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