A Cellular Automata based test scheme for TSVs in 3D ICs

Author

Chakraborty, Bidesh ; Dalui, Mamata

Author_Institution

Dept. of Comput. Sci. & Eng., Haldia Inst. of Technol., Haldia, India

fYear

2012

fDate

15-16 March 2012

Firstpage

723

Lastpage

727

Abstract

A three-dimensional (3D) IC containing multiple dies, connected by through silicon vias (TSV) offers many benefits over current 2D ICs. Reliability and accuracy of 3D integration using thousands of TSVs has to be ensured. However, 3D testing has found to be more difficult compared to that of 2D. This work proposes an elegant test scheme for high speed stuck-at-fault detection in such a system. It ensures a quick decision on the presence of faults in TSVs with just a single comparison. The solution is based on the modular structure of Cellular Automata (CA). A special class of CA referred to as the SACA (single length single cycle attractor cellular automata) has been introduced to achieve a cost-effective realization of the hardware. The SACA based unconventional scheme ensures minimum computation, easy hardware implementation of the test logic, as well as high scalability.

Keywords

cellular automata; integrated circuit reliability; integrated circuit testing; logic testing; three-dimensional integrated circuits; 2D IC; 3D IC; 3D testing; SACA based unconventional scheme; TSV; cellular automata based test scheme; high speed stuck-at-fault detection; reliability; single length single cycle attractor cellular automata; test logic; three-dimensional integrated circuit; through silicon via; Scalability; Silicon; Testing; 3D IC; Cellular Automata (CA); Fault Detection; SACA; TSV;

fLanguage

English

Publisher

ieee

Conference_Titel

Devices, Circuits and Systems (ICDCS), 2012 International Conference on

Conference_Location

Coimbatore

Print_ISBN

978-1-4577-1545-7

Type

conf

DOI

10.1109/ICDCSyst.2012.6188764

Filename

6188764