DocumentCode
1910413
Title
Correlation between electromigration damage kinetics and microstructure in Cu interconnects
Author
Gladkikh, A. ; Karpovski, M. ; Palevski, A.
Author_Institution
Department of Physical Electronics, Tel Aviv University, Israel
fYear
1997
fDate
22-24 September 1997
Firstpage
448
Lastpage
451
Keywords
Compressive stress; Conductors; Electromigration; Energy measurement; Extraterrestrial measurements; Grain boundaries; Integrated circuit interconnections; Kinetic theory; Microstructure; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN
2-86332-221-4
Type
conf
DOI
10.1109/ESSDERC.1997.194462
Filename
1503392
Link To Document