• DocumentCode
    1910430
  • Title

    Finite Element Analysis of Stress Distributions in Interconnect Structures

  • Author

    Coughlan, J. ; Foley, S. ; Mathewson, A.

  • Author_Institution
    National Microelectronics Research Centre, Ireland
  • fYear
    1997
  • fDate
    22-24 September 1997
  • Firstpage
    452
  • Lastpage
    455
  • Keywords
    Adhesives; Delamination; Dielectric materials; Electromigration; Failure analysis; Finite element methods; Plugs; Silicon; Tensile stress; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 1997. Proceeding of the 27th European
  • Print_ISBN
    2-86332-221-4
  • Type

    conf

  • DOI
    10.1109/ESSDERC.1997.194463
  • Filename
    1503393
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1910430