DocumentCode
1910474
Title
A systematic approach for IC fab design
Author
Chen, J.C. ; Cheng-Chung Chien
Author_Institution
Dept. of Ind. Eng., Chung Yuan Christian Univ., Chung Li
fYear
1997
fDate
6-8 Oct 1997
Abstract
Facilities design is crucial to the performance of IC fabs. It is important to speed up the planning and design processes of IC fabs to react to the rapid changes of products, technologies, and equipment in IC manufacturing industry. This paper proposes a systematic three-phase approach to the design of IC fabs: initial design, rough-cut design, and detailed design. Each phase can be implemented on the basis of commercial packages. The importance of each phase is discussed, and the characteristics of several commercial packages are investigated
Keywords
design engineering; electronics industry; integrated circuit manufacture; planning; IC fab design; IC manufacturing industry; design processes; detailed design; facilities design; planning; rough-cut design; systematic three-phase approach; Algorithm design and analysis; Costs; Industrial engineering; Integrated circuit layout; Investments; Packaging machines; Process planning; Production; Semiconductor device manufacture; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-3752-2
Type
conf
DOI
10.1109/ISSM.1997.664609
Filename
664609
Link To Document