DocumentCode :
1910495
Title :
Electro-Thermal Interaction on Circuit Level under the Influence of Packaging
Author :
Digele, G. ; Lindenkreuz, S. ; Kasper, E.
Author_Institution :
Robert Bosch GmbH, Germany and University of Stuttgart, Germany
fYear :
1997
fDate :
22-24 September 1997
Firstpage :
460
Lastpage :
463
Keywords :
Circuit simulation; Coupling circuits; Electrothermal effects; Nonlinear equations; Resistance heating; Semiconductor device packaging; Silicon; Temperature dependence; Temperature sensors; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN :
2-86332-221-4
Type :
conf
DOI :
10.1109/ESSDERC.1997.194465
Filename :
1503395
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1910495
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