DocumentCode
1910651
Title
Power electronic circuit simulation using bond graph and Petri network techniques
Author
Allard, Bruno ; Morel, Hervé ; Chante, Jean Pierre
Author_Institution
CEGELY, Villeurbanne, France
fYear
1993
fDate
20-24 Jun 1993
Firstpage
27
Lastpage
32
Abstract
The authors have proposed a semiconductor device modular modeling method based on the bond graphs techniques of Automatics. The application of bond-graph techniques to power electronic circuit modeling introduces the problem of causality switching. In order to clearly solve the problem of causality switching, the authors propose to model every elementary component with a Petri net. Simulation results are given
Keywords
Petri nets; bond graphs; circuit analysis computing; power electronics; semiconductor device models; switching circuits; Petri network; bond graph; causality switching; circuit simulation; power electronic circuit; semiconductor device modular modeling; Automatic control; Bonding; Circuit simulation; Electronic mail; Power electronics; Power semiconductor switches; Power system modeling; Semiconductor devices; Thermal force; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 1993. PESC '93 Record., 24th Annual IEEE
Conference_Location
Seattle, WA
Print_ISBN
0-7803-1243-0
Type
conf
DOI
10.1109/PESC.1993.471933
Filename
471933
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