DocumentCode :
1910651
Title :
Power electronic circuit simulation using bond graph and Petri network techniques
Author :
Allard, Bruno ; Morel, Hervé ; Chante, Jean Pierre
Author_Institution :
CEGELY, Villeurbanne, France
fYear :
1993
fDate :
20-24 Jun 1993
Firstpage :
27
Lastpage :
32
Abstract :
The authors have proposed a semiconductor device modular modeling method based on the bond graphs techniques of Automatics. The application of bond-graph techniques to power electronic circuit modeling introduces the problem of causality switching. In order to clearly solve the problem of causality switching, the authors propose to model every elementary component with a Petri net. Simulation results are given
Keywords :
Petri nets; bond graphs; circuit analysis computing; power electronics; semiconductor device models; switching circuits; Petri network; bond graph; causality switching; circuit simulation; power electronic circuit; semiconductor device modular modeling; Automatic control; Bonding; Circuit simulation; Electronic mail; Power electronics; Power semiconductor switches; Power system modeling; Semiconductor devices; Thermal force; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 1993. PESC '93 Record., 24th Annual IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-1243-0
Type :
conf
DOI :
10.1109/PESC.1993.471933
Filename :
471933
Link To Document :
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