Title : 
Towards a broadband front-end for cooperative spectrum sensing networks
         
        
            Author : 
Lohmiller, Peter ; Elsokary, Ahmed ; Schumacher, Hermann ; Chartier, Sebastien
         
        
            Author_Institution : 
Inst. of Electron Devices & Circuits, Ulm Univ., Ulm, Germany
         
        
        
        
        
        
            Abstract : 
Cooperative spectrum sensing in cognitive radio (CR) avoids hidden terminal problems common to network architectures with central sensing nodes. It also lowers the requirements for the sensing radio front-ends. This paper presents a multi-chip module RF front-end implemented from custom RFICs realized in an 0.25 μm SiGe BiCMOS technology. Using an up/down-conversion heterodyne architecture, the front-end achieves a conversion gain exceeding 17.2 dB and a frequency range up to 4.5 GHz. The noise figure between 15.4 dB and 19.8 dB and the input referred third order intercept point (IIP3) of -7.5dBm constitute a noise/linearity trade-off and are acceptable for compact distributed sensing nodes. The module draws 150mA from a single 5V supply. It was validated in real-world sensing scenarios, combined with a broadband discone antenna, external local oscillators, and a Virtex 6 FPGA evaluation board.
         
        
            Keywords : 
BiCMOS integrated circuits; Ge-Si alloys; broadband antennas; cognitive radio; cooperative communication; field programmable gate arrays; microwave integrated circuits; microwave oscillators; radio spectrum management; semiconductor materials; silicon compounds; BiCMOS technology; CR; IIP3; RFIC; SiGe; Virtex 6 FPGA evaluation board; broadband discone antenna; broadband front-end; central sensing node; cognitive radio; compact distributed sensing node; conversion gain; cooperative spectrum sensing network; current 150 mA; hidden terminal problems avoidance; local oscillator; multichip module RF front-end implementation; noise figure; radio front-end; real-world sensing scenario; size 0.25 mum; third order intercept point; up-down-conversion heterodyne architecture; voltage 5 V; Bandwidth; Gain; Noise; Noise measurement; Radio frequency; Radiofrequency integrated circuits; Sensors;
         
        
        
        
            Conference_Titel : 
Microwave Conference (EuMC), 2014 44th European
         
        
            Conference_Location : 
Rome
         
        
        
            DOI : 
10.1109/EuMC.2014.6986391