DocumentCode
1911578
Title
Failure Time Based Reliability Growth in Product Development and Manufacturing
Author
Jin, Tongdan ; Liao, Haitao ; Luo, Wen
fYear
2007
fDate
22-25 Jan. 2007
Firstpage
488
Lastpage
493
Abstract
The failure-in-time (FIT) rate is widely used to quantify the reliability of a electronic component. It fails to indicate the portion of the failures due to either environmental or electrical stresses or issues that are related to process/handing, manufacturing and applications. To meet this end, FIT-based corrective action driven metrics are proposed to link the failure mode (FM) with components and non-component faults. First the conventional failure mode pareto is reviewed and its deficiency is discussed. Then a new index called the failure mode rate (FMR) is introduced to monitor the FM trend and evaluate the effectiveness of corrective actions (C/As). Based on the FMR, the FIT rate is extended to non-component failure mode and further to individual failure mode in predicting the reliability of electronic products. The extended FIT rate enables product designers to narrow down the root-cause of the failure, identify the C/A ownership, and estimate the MTBF improvement. The new metrics provide a guideline for prioritizing resources to attack the critical failures with the minimum cost.
Keywords
failure analysis; product development; reliability; corrective action driven metrics; electronic component; failure mode; failure time based reliability growth; manufacturing; product development; Consumer electronics; Electronic components; Magnetic resonance; Manufacturing processes; Product design; Product development; Relays; Reliability engineering; Software design; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 2007. RAMS '07. Annual
Conference_Location
Orlando, FL
ISSN
0149-144X
Print_ISBN
0-7803-9766-5
Electronic_ISBN
0149-144X
Type
conf
DOI
10.1109/RAMS.2007.328084
Filename
4126400
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