Title :
The study for micro-semiconductor cooling temperature calibration equipment
Author :
Ma, Zhiwei ; Weng, Wenbing ; Liu, Huijun
Author_Institution :
Environ. & Archit. Inst., Univ. of Shanghai for Sci. & Technol., Shanghai, China
Abstract :
This paper presents a temperature calibration equipment of micro-semiconductor cooling. Refrigerating capacity of the semiconductor cooling was tested with heat balance method. In equipment production, process of heat transfer from refrigeration film to temperature chamber is calculated and analyzed. Heat loss in heat transfer may be known by calculation of heat transfer process. When it is churned up, calculates convective heat transfer process of mediator and cold block.
Keywords :
calibration; cooling; heat transfer; integrated circuit manufacture; production equipment; refrigeration; coπvective heat transfer process; heat balance method; heat loss; microsemiconductor cooling temperature calibration equipment; refrigeration film; temperature chamber; Cooling; Heat transfer; Water heating; cooling capacity; heat transfer; semiconductor chip cooling; temperature calibration; thermostat;
Conference_Titel :
Materials for Renewable Energy & Environment (ICMREE), 2011 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-61284-749-8
DOI :
10.1109/ICMREE.2011.5930564
