DocumentCode
1911999
Title
On-chip cooling of hot-spots with a copper micro-evaporator
Author
Costa-Patry, Etienne ; Thome, John Richard
Author_Institution
Heat & Mass Transfer Lab. (LTCM), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
fYear
2012
fDate
18-22 March 2012
Firstpage
125
Lastpage
129
Abstract
Hot-spots are present in micro-electronics and are challenging to cool effectively. Using a copper micro-evaporator mounted on a pseudo-chip, on-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on a flow pattern-based prediction method developed for uniform heat flux conditions, the experimental results could be well predicted.
Keywords
cooling; copper; integrated circuit packaging; thermal management (packaging); copper microevaporator; flow instabilitty; flow pattern-based prediction; heat flux; hot-spots; on-chip two-phase cooling; pseudochip; Cooling; Copper; Heat transfer; Heating; Prediction methods; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-1110-6
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2012.6188837
Filename
6188837
Link To Document