Title :
On-chip cooling of hot-spots with a copper micro-evaporator
Author :
Costa-Patry, Etienne ; Thome, John Richard
Author_Institution :
Heat & Mass Transfer Lab. (LTCM), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
Abstract :
Hot-spots are present in micro-electronics and are challenging to cool effectively. Using a copper micro-evaporator mounted on a pseudo-chip, on-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on a flow pattern-based prediction method developed for uniform heat flux conditions, the experimental results could be well predicted.
Keywords :
cooling; copper; integrated circuit packaging; thermal management (packaging); copper microevaporator; flow instabilitty; flow pattern-based prediction; heat flux; hot-spots; on-chip two-phase cooling; pseudochip; Cooling; Copper; Heat transfer; Heating; Prediction methods; System-on-a-chip;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1110-6
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2012.6188837
