Title :
Test ASIC for investigation of thermal coupling in Many-Core Architectures
Author :
Szermer, Michal ; Maj, Cezary ; Pietrzak, Piotr ; Janicki, Marcin ; Zajac, Piotr ; Napieralski, Andrzej
Author_Institution :
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
Abstract :
This paper presents the design of a test ASIC, which was intended for the investigation of thermal coupling in Many-Core Architectures. Particular sections of the paper describe in detail the design concept and simulated operation of the ASIC which is currently sent for manufacturing.
Keywords :
application specific integrated circuits; integrated circuit design; integrated circuit testing; microprocessor chips; multiprocessing systems; thermal management (packaging); design concept; many-core architectures; simulated operation; test ASIC; thermal coupling; Application specific integrated circuits; Computer architecture; Couplings; Heating; Program processors; Temperature measurement; Temperature sensors; Many-Core Architectures; Test ASIC; Thermal Coupling;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1110-6
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2012.6188839
